Author:
Eom Daehong,Kim Kyunghyun,Shin Yugyun
Abstract
Watermark and pattern collapse are easily affected by wetting properties of wafer surfaces and pattern size. Also, these issues are strongly dependent on types of dryer, IPA vapor or liquid dryer. Using the IPA liquid dryer, watermark can easily controlled regardless of wafer types and wetting properties. However, in the case of IPA vapor dryerm watermark is easily affected by wetting properties of wafer surface.
Publisher
The Electrochemical Society
Cited by
4 articles.
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