Analysis of Cu(I) Complexes in Copper Sulfate Electroplating Solution by Using Reaction Kinetics with a Chelate Reagent

Abstract

Analysis of Cu(I) in copper sulfate electroplating solutions was conducted by absorption of a chelate of Cu(I) with bathocuproinedisulfonic acid, disodium salt (BCS). The absorbance of the color reaction of Cu(I) increased quickly in a few minutes after mixing with the chelate reagent and subsequently continued to increase slowly. To analyze the reaction kinetics of the color reaction, we divided Cu(I) complexes into two groups, small complexes and large Cu(I)-PEG complexes, and assumed the reaction of each group of complexes and BCS is a first order reaction with a specific reaction rate constant. We simulated the absorption curve with a good correlation and obtained the concentrations and the time constants, inverse of rate constants, of small complexes and large Cu(I)-PEG complexes. These concentrations and time constants are important parameters to control plating solutions. The time constant of small complexes can be attributed to the variation of the proportions of these small complexes. The smaller time constant of Cu(I)-PEG complexes can be considered the larger size distribution of Cu(I)-PEG with different chain lengths. Using this analysis, we monitored the variation of Cu(I) concentration in production lines for one month and found the increase of small complexes during the resting state of the lines. This increase corresponded to the tendency of occurring of brightening troubles.