Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Improved post-etch cleaning of dual-damascene system for 0.18-μm technology
2. Effect of O 2 plasma treatment on the properties of SiO 2 aerogel film
3. Post etch cleaning of low-k dielectric materials for advanced interconnects: Characterization and process optimization
4. Post Dry-Etch Cleaning Issues of an Organic Low-K Dielectric
5. M. Boumerzoug, H. Xu, and R. L. Bersin, inElectrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization, P. C. Andricacos, J. O. Dukovic, G. S. Mathad, G. M. Oleszek, H. S. Rathore, C. Reidsema-Simpson, D. D. Snyder, and R. K. Ulrich, Editors, PV 98-6, p. 170, The Electrochemical Society Proceedings, Series, Pennington, NJ (1986).
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12 articles.
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