Effect of Microwave Processing on Oxygen Plasma-Assisted Bonding Enabling Rapid Layer Transfer
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Published:2013-11-11
Issue:1
Volume:3
Page:P4-P6
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ISSN:2162-8742
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Container-title:ECS Solid State Letters
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language:en
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Short-container-title:ECS Solid State Letters
Author:
Ho C.- C.,Lo F. S.,Jeng S. C.,Li J.- H.,Chang H.- H.,Lee T.- H.
Publisher
The Electrochemical Society
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials