Formation of Shallow Junctions during Rapid Thermal Processing from Electron‐Beam Deposited Boron Sources-Reference-Cited by-同舟云学术

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Formation of Shallow Junctions during Rapid Thermal Processing from Electron‐Beam Deposited Boron Sources

Published:1996-09-01 Issue:9 Volume:143 Page:2981-2989
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Zagozdzon‐Wosik W.¹,Korablev K.¹,Rusakova I.²,Simons D.³,Shi J. H.⁴,Chi P.³,Wolfe J. C.¹

Affiliation:

1. Department of Electrical and Computer Engineering, University of Houston, Houston, Texas 77204

2. Texas Center for Superconductivity, University of Houston, Houston, Texas 77204

3. NIST, Gaithersburg, Maryland 20899

4. SEMATECH, Austin, Texas 78741

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.1837136/pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solid Source Diffusion for Shallow Junctions;Encyclopedia of Materials: Science and Technology;2001

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