1. S. A. Campbell,The Science and Engineering of Microelectronic Fabrication, Chap. 8, 9, and 14, Oxford University Press, New York (1996).
2. Free surface Stokes flow over topography
3. Transport Phenomena That Control Electroplated Copper Filling of Submicron Vias and Trenches
4. H. Lin, A. A. Busnaina, and I. I. Suni,IEEE Interconnect Technology Conference Proceedings, pp. 49-51 (2000).
5. A. D. Hebda, K. A. Romero, D. M. Seif, and T. W. Peterson, inCleaning Technology in Semiconductor Device Manufacturing IV, T. Hattori, R. E. Novak, and J. Ruzyllo, Editors, PV 99-36, pp. 569-576, The Electrochemical Society Proceedings Series, Pennington, NJ (1999).