Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes

Abstract

Plasma activated wafer bonding generated a high interest in last decade due to the important process temperature reduction. With the main advantage of bringing some applications at industrial degree of feasibility. An example of process which benefits from this new process is silicon fusion bonding: by using plasma activation the bond process temperature and time are reduced at values which make wafer bonding compatible with industrial manufacturing requirements. A newly developed process allowing bonding of two substrates in the plasma activation chamber is foreseen as a very interesting approach for numerous applications, especially in the field of engineered substrates fabrication.