Modeling the Charge-Transfer Resistance to Determine the Role of Guar and Activated Polyacrylamide in Copper Electrodeposition

Author:

Fabian C. P.,Ridd M. J.,Sheehan M. E.,Mandin Ph.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference50 articles.

1. E. Budevski, G. Staikov, and W. Lorenz ,Electrochemical Phase Formation and Growt: An Introduction to the Initial Stages of Metal Deposition, VCH, New York (1996).

2. E. Ilgar and T. J. O’Keefe , inAqueous Electrotechnologies: Progress in Theory and Practice, D. Dreisinger , Editor, p. 51, The Metallurgical Society of the American Institute of Mining and Metallurgy (1997).

3. Influence of Chloride Anions on the Mechanism of Copper Electrodeposition from Acidic Sulfate Electrolytes

4. T. Robinson, W. Davenport, M. Moats, G. Karcas, and S. Demetrio , inProceedings of the Sixth International Copper-Cobre Conference, G. E. Houlachi , J. D. Edwards , and T. G. Robinson , Editors, Toronto, Canada, p. 375 (2007).

5. H. Mark, N. Gaylord, and N. Bikales ,Encyclopedia of Polymer Science and Technology, p. 401, Wiley-Interscience, New York (1969).

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