Affiliation:
1. IBM General Technology Division, East Fishkill, Hopewell Junction, New York 12533
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Cited by
59 articles.
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2. Application and evaluation of AL-X polymer dielectric for flip chip and wafer level package bumping;2009 59th Electronic Components and Technology Conference;2009-05
3. Chip Integration;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
4. Effects of the polymer residues on via contact resistance after reactive ion etching;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2002
5. Organic Dielectrics in Multilevel Metallization of Integrated Circuits;Handbook of Thin Film Deposition Processes and Techniques;2001