The Effects of Composition and Design of Experiment on the Quality of Al-Ge Eutectic Bonding for Wafer Level Packaging
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Published:2013-03-15
Issue:7
Volume:50
Page:151-158
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ISSN:1938-5862
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Container-title:ECS Transactions
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language:
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Short-container-title:ECS Trans.
Author:
Huang Xin-Hua,Cheng Chun-Wen,Liu Ping-Yin,Hsieh Yuan-Chih,Chao Lan-Lin,Tsai Chia-Shiung,Huang David,Colinge Cindy
Abstract
The aluminum-germanium (Al-Ge) eutectic system was studied for the optimization of bonding parameters for hermetic sealing applications. The parameters that were varied included the ratio of aluminum to germanium, bonding temperature, force, and time. It was found that the critical eutectic ratio of Al to Ge produced a finer intermetallic distribution and better uniformity across wafers leading to higher shear strength. Design of experiment (DOE) was used to determine the most influential process parameters. Bond temperature and force had the largest effect on shear strength.
Publisher
The Electrochemical Society