Author:
Kim Sunjung,Duquette David J.
Publisher
The Electrochemical Society
Subject
Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering
Reference25 articles.
1. The chemistry of d1 complexes of niobium, tantalum, zirconium and hafnium †
2. Nucleation and Growth of Electrochemically Deposited Copper on TiN and Copper from a Cu-NH[sub 3] Bath
3. “Seedless” electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra large scale integration (ULSI) devices
4. S. Kim and D. J. Duquette , in
Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics
, G. S. Mathad , B. C. Baker , C. Reidsema-Simpson , H. S. Rathore , and T. L. Ritzdorf , Editors, PV 2002-22, p. 55, The Electrochemical Society Proceedings Series, Pennington, NJ (2002).
5. Multiple Bath Usage for Adhesion Enhancement of Directly Electrodeposited Copper on TaN
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