Author:
Yen Bi-Ming,Lin Johnny,Lee Chris,Hegarty Mike,Loewenhardt Peter
Abstract
The emergence of new integration schemes and materials for advanced technology nodes has presented greater challenges to both etch and post etch wet clean. The mutual interactions between etch and clean processes must be considered, thus having both etch and clean process optimized together has become more essential and beneficial in order to provide the optimized process solution.
Publisher
The Electrochemical Society
Cited by
1 articles.
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