Modeling and Experimental Validation of Electroplating Deposit Distributions from Copper Sulfate Solutions

Abstract

3-D Modeling of copper electrodeposition in a copper sulfate solutions was carried out using COMSOL Multiphysics. The results of the model were validated using experimental plating cells of different geometries. A new empirical equation was developed to predict deposit thickness on protruding or recessed features in a plating cell with accuracy comparable to the COMSOL model.