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Preferential Copper Electrodeposition at Submicrometer Trenches by Consumption of Halide Ion

  • Published:2003 Issue:6 Volume:6 Page:C92
  • ISSN:1099-0062
  • Container-title:Electrochemical and Solid-State Letters
  • language:en
  • Short-container-title:Electrochem. Solid-State Lett.

Author:

Hayase Masanori,Taketani Munemasa,Hatsuzawa Takeshi,Hayabusa Keisuke

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Competitive adsorption of Cu2+ and chloride ions, polyethylene glycol and sulfur-containing organic additives on copper in sulfuric acid electrolytes;International Journal of Corrosion and Scale Inhibition;2023-12-24

3. TSV filling with copper electro-deposition by using phenyl disulfide propane sodium;Sixth International Conference on Advanced Electronic Materials, Computers, and Software Engineering (AEMCSE 2023);2023-08-16

4. TSV Filling with Copper Electro-deposition by Using Sodium 3-[[(dimethylamino) thioxomethyl] thio] Propane Sulphonate;Journal of Physics: Conference Series;2023-08-01

5. Electrochemical behavior of through-hole electrodeposition inhibitor EO-PO under periodic pulse reverse;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2022-12
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