Author:
Hara Tohru,Miyazawa Kei,Miyamoto Mitsuo
Publisher
The Electrochemical Society
Subject
Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering
Reference8 articles.
1. T. Hara, in
Proceedings of the Seventh International VLSI Multi-level Interconnect Conference
, p. 459, Santa Clara, CA (2000).
2. Stress in Copper Seed Layer Employing in the Copper Interconnection
3. Control of Agglomeration on Copper Seed Layer Employed in the Copper Interconnection
4. T. Hara, K. Miyazawa and K. Omote, in Extended Abstracts of the 49th Fall Meeting of the Japan Society of Applied Physics (2001).
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