From 2-Dimensional Lithography To 3-Dimensional Structures
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Published:2010-11-23
Issue:1
Volume:27
Page:421-426
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ISSN:1938-5862
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Container-title:ECS Transactions
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language:
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Short-container-title:ECS Trans.
Author:
Van Zeijl Henk,Wei Jia,Shen Chenggang,Verhaar Theo M.,Maury Pascale,Sarro Lina M.
Abstract
Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and etch strategies are discussed to use advanced 2D lithography to fabricate 3D structures.
Publisher
The Electrochemical Society
Cited by
1 articles.
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