Insights into the Tribological and Kinetic Attributes of Retaining Rings in Chemical Mechanical Planarization
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference14 articles.
1. Epitaxial Growth of High-Quality 4H-SiC Carbon-Face by Low-Pressure Hot-Wall Chemical Vapor Deposition
2. Tribological and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process
3. Carrier Transport Study of TMIn-Treated InGaN LEDs by Using Quantum Efficiency and Time-Resolved Electro-Luminescence Measurements
4. Effect of temperature in titanium chemical mechanical planarization
5. Method for Ultra Rapid Determination of the Lubrication Mechanism in Chemical Mechanical Planarization
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1. Enhancing resistance of poly(ether ketone ketone) to high‐temperature steam through crosslinking and crystallization control;Journal of Applied Polymer Science;2019-03-19
2. Ultra-Rapid Determination of Material Removal Rates Based Solely on Tribological Data in Chemical Mechanical Planarization;ECS Journal of Solid State Science and Technology;2019
3. Inferences of Slurry Bow Wave Width from Mean Coefficient of Friction and Directivity in Chemical Mechanical Planarization;ECS Journal of Solid State Science and Technology;2018-12-19
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