Integration of Molecular Components into Silicon Memory Devices-Reference-Cited by-同舟云学术

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Integration of Molecular Components into Silicon Memory Devices

Published:2004-03-01 Issue:1 Volume:13 Page:34-38
ISSN:1064-8208
Container-title:The Electrochemical Society Interface
language:
Short-container-title:Electrochem. Soc. Interface

Author:

Kuhr Werner G.

Publisher

The Electrochemical Society

Subject

Electrochemistry

Link

https://iopscience.iop.org/article/10.1149/2.F07041IF/pdf

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-Yield Functional Molecular Electronic Devices;ACS Nano;2017-06-09

2. Measurement of the Surface Recombination Velocity in Organically Functionalized Silicon Nanostructures: The Case of Silicon on Insulator;The Journal of Physical Chemistry C;2011-10-25

3. Silicon Modification with Molecules Derived from Ferrocene: Effect of the Crystallographic Orientation of Silicon in the Electron–Transfer Rates;Molecular Crystals and Liquid Crystals;2010-05-25

4. Progress with Molecular Electronic Junctions: Meeting Experimental Challenges in Design and Fabrication;Advanced Materials;2009-11-20

5. Conducting Polymer Memory Devices Based on Dynamic Doping;Journal of the American Chemical Society;2008-07-23

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