Anisotropic Reactive Ion Etching of MoSi2 and In Situ Doped n+ and p+ Polysilicon Using Cl2 and BCl3

Author:

Mele T. C.1,Arney S. C.1,Krusius J. P.1,MacDonald N. C.1

Affiliation:

1. School of Electrical Engineering and National Nanofabrication Facility, Cornell University, Ithaca, New York 14853

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Dry Etching of Electronic Oxides, Polymers, and Semiconductors;Plasma Processes and Polymers;2005-01-12

2. Plasma Chemistry;Wiley Encyclopedia of Electrical and Electronics Engineering;1999-12-27

3. Polysilicon gate etching in high density plasmas. IV. Comparison of photoresist and oxide masked polysilicon etching-thickness determination of gate oxide layers using x-ray photoelectron spectroscopy;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1996-11

4. Fabrication of high aspect ratio structures for microchannel plates;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1995-11

5. Preparation of transmission electron microscopy cross sections using nanofabrication techniques;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1992-01

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