Integration of Microfabricated Capacitive Bridge and Thermistor on the Alumina Substrates

Abstract

This paper describes a thin film fabrication technique of planar metallic microstructure with geometries between 10 and 20μm on 96% alumina substrate. This technique integrates a microfabricated capacitive bridge and thermistor on the same substrate employing metal and vacuum deposition. The procedure showed good resolution using a substrate with medium grain size between 3-5μm and average peak to valley surface roughness (Ra) 0.1μm. The film adhesion was tested by soldering metallic wires on the capacitor electrodes. These structures can be used for thin film characterization. We also deposited an oxide thin film (TiO2:WO3) by using polymeric precursors method.