Author:
Elarde Victor Christopher,Miyamoto Haruki,Chan Ray,Stender Chris,Youtsey Chris,Adams Jessica G J,Wibowo Andree,Tatavarti Rao,Osowski Mark,Pan Noren
Abstract
MicroLink Devices has developed an epitaxial liftoff (ELO) technology for removing thin device layers from the surface of a semiconductor wafer using a flexible metallic sheet to provide structural support. The wafer is left intact and available for use in a subsequent growth cycle. This technology has been applied to high-efficiency, multi-junction solar cells. Removal of the substrate allows the devices to achieve very high specific power of approximately 1000W/kg. For large area devices, the cost of the substrate can be a significant component of the overall device manufacturing cost. By utilizing ELO technology to reuse the substrate for multiple growth cycles, the manufacturing cost of the device can be dramatically reduced.
Publisher
The Electrochemical Society
Cited by
2 articles.
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