Electroless Deposition of Thin-Film Cobalt-Tungsten-Phosphorus Layers Using Tungsten Phosphoric Acid (H[sub 3][P(W[sub 3]O[sub 10])[sub 4]]) for ULSI and MEMS Applications-Reference-Cited by-同舟云学术

Electroless Deposition of Thin-Film Cobalt-Tungsten-Phosphorus Layers Using Tungsten Phosphoric Acid (H[sub 3][P(W[sub 3]O[sub 10])[sub 4]]) for ULSI and MEMS Applications

Published:2001 Issue:3 Volume:148 Page:C162
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Shacham-Diamand Yosi,Sverdlov Y.,Petrov N.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. T. Kikkawa, inProceedings of the Advanced Metallization Conference, AMC 1998, Materials Research Society, p. 705 (1998).

2. G. Dixit, F. Chen, and A. Sinha, inProceedings of the Advanced Metallization Conference, AMC 1998, Materials Research Society, p. 289 (1998).

3. Electrical Properties of Giant‐Grain Copper Thin Films Formed by a Low Kinetic Energy Particle Process

4. WNx diffusion barriers between Si and Cu

Cited by 40 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. RETRACTED: Analysis on corrosion resistant of electrodeposited ternary Co-W-P alloy;Applied Surface Science;2019-05

2. Effect of phosphorous content and heat treatment on the structure, hardness and wear behavior of Co-P coatings;Wear;2019-03

3. Electroless deposition of CoBW coatings using morpholine borane as a reducing agent;Thin Solid Films;2017-08

4. Electroless Deposition of CoMoP and CoMoB Alloy Thin Films;ECS Transactions;2017-01-05

5. Composition and Microstructure;Amorphous and Nano Alloys Electroless Depositions;2016