Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging

Published:2005 Issue:12 Volume:8 Page:G330
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Park Gil-Soo,Kim Yong-Kook,Paek Kyeong-Kap,Kim Jin-Sang,Lee Jong-Heun,Ju Byeong-Kwon

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference16 articles.

1. Silicon‐to‐silicon direct bonding method

2. Low temperature wafer anodic bonding

3. Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond

4. Assembling three-dimensional microstructures using gold-silicon eutectic bonding

5. Low-temperature full wafer adhesive bonding

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display;Materials Science in Semiconductor Processing;2024-06

2. Room temperature bonding of Au assisted by self-assembled monolayer;Applied Physics Letters;2023-01-30

3. Investigation of Metal Interconnect for Wafer-Level and Sealable Miniaturized MEMS Encapsulation;IEEE Transactions on Electron Devices;2021-11

4. Performance and Manufacturing of Silicon-Based Vapor Chambers;Applied Mechanics Reviews;2021-01-01

5. The effects of thermocompression bonding on Si/ SiO2 multilayer thin-film based critical dimension structures;International Conference on Optoelectronic and Microelectronic Technology and Application;2020-12-04

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3