Monolayer Molecular Adsorption Model for Electroless Copper Plating Process-Reference-Cited by-同舟云学术

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Monolayer Molecular Adsorption Model for Electroless Copper Plating Process

Published:1995-04-01 Issue:4 Volume:142 Page:1149-1152
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Shigematsu K.¹,Kondo K.²,Hayakawa K.¹,Irie M.³

Affiliation:

1. Nippondenso Company, Limited, Engineering Computing Department, 1‐1, Showa‐cho, Kariyashi, Aichi 448, Japan

2. Nippondenso Company, Limited, Production Engineering Department, 1‐1, Showa‐cho, Kariyashi, Aichi 448, Japan

3. Kyushu University, Institute of Advanced Material Study, Kasuga‐koen 6‐1, Fukuoka 816, Japan

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2044144/pdf

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Monte Carlo Simulation of the Electrodeposition of Copper;Journal of The Electrochemical Society;2002

2. A Two‐Dimensional Computer Simulation of Electroless Copper Deposition;Journal of The Electrochemical Society;1997-04-01

3. Erratum: “Monolayer Molecular Adsorption Model for Electroless Copper Plating Process” [J. Electrochem. Soc., 142, 1149 (1995)];Journal of The Electrochemical Society;1996-11-01

4. Copper;Metal Finishing;1996-02

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