Author:
Matsushima J. T.,Santos L. C. D.,Couto A. B.,Baldan M. R.,Ferreira N. G.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Meiwes-Broer K. H. , Metal cluster at surface – structure, quantum properties, Physical Chemistry, Springer-Verlag, Berlin (2000).
2. Dini J. W. , in Modern Electroplating, 4th ed., Schlesinger M. Paunovic M. Editors, p. 61, Wiley-Interescience, New York (2000).
3. Damascene copper electroplating for chip interconnections
4. Preparation of gold nanoparticles by heat treatment of sputter deposited gold on boron-doped diamond film electrode
5. Nafion®-assisted deposition of microemulsion-synthesized platinum nanoparticles on BDD
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献