Numerical Analysis on the Heat Transfer of Heatsink with Micro-Pin-Fins

Abstract

This paper numerically studies the heat transfer in heat sinks with micro-pin-fins. Commercial software, ICEPAK, was used to explore the effect of micro-pin-fin array design on the flow rate and heat transfer characteristics of liquid cooling heat sink. The parameters include the diameter of pin fin, the gap between the pin fins, and the relative position between the pin fins. The diameters of the pin fin are 0.5mm, 0.6mm, and 0.7mm, respectively. The gap between the pin fins are 0.2mm, 0.25mm, 0.3mm, 0.4mm, and 0.5mm, respectively. Three types of fin array arrangements are set with different longitudinal spacing and transverse spacing. The driving force of the working fluid is the pressure head with 500, 1500, and 3000 Pa, respectively. Results show that the effective thermal resistance ranges from 0.27 to 0.55 with the power density of 300kW/m2.