(Invited) MEMS and Photonics Module Integration into SiGe BiCMOS Technology for More than Moore Functional Diversification

Abstract

The “More Than Moore” approach is targeting on diversification by combining different technologies based on a reasonable scaling level. Here, SiGe BiCMOS technology acts as the baseline process for the integration of modules increasing the functionality and by this way enlarging the spectrum for embedded system applications. In this paper we focus on the monolithic integration approach of MEMS (micro-electro-mechanical systems) into the back-end-of-line (BEOL) of the Si process, and of optical components to combine electronics and photonics (Si Photonics).