Low Temperature Cu Etching Using CH4-Based Plasmas
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference42 articles.
1. Moore's law: past, present and future
2. Copper Metallization for High Performance Silicon Technology
3. Encapsulated silver for integrated circuit metallization
4. Reactive ion etching of copper in SiCl4‐based plasmas
5. Damascene copper electroplating for chip interconnections
Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Influence of an etch mask on the etch profile of copper thin films in propanol/Ar gas mixture;Materials Science in Semiconductor Processing;2025-01
2. Etch characteristics of cobalt thin films using high density plasma of CH3COCH3/Ar gas mixture;Microelectronic Engineering;2024-11
3. Effect of the addition of O2 on copper etching using high density plasma of acetylacetonate/Ar;Materials Science in Semiconductor Processing;2022-12
4. Nanometer-scale etching of copper thin films in high-density plasma of an ethylenediamine/acetic acid/argon gas mixture;Journal of Vacuum Science & Technology B;2022-01
5. Reactivity Evaluation on Copper Etching Using Organic Chelators;Korean Journal of Materials Research;2021-10-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3