Author:
Kim Hoyoun,Park Beumyoung,Lee Sangick,Jeong Haedo,Dornfeld David A.
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Pattern Geometry Effects in the Chemical‐Mechanical Polishing of Inlaid Copper Structures
2. Microscale Dishing Effect in a Chemical Mechanical Planarization Process for Trench Isolation
3. D. A. Hansen, G. Moloney, and M. E. Witty, inChemical Mechanical Planarization in IC Device ManufacturingIII, Y. A. Arimoto, R. L. Opila, C. Reidsema Simpson, K. B. Sundaram, I. Ali, and Y. Homma, Editors, PV 99-37, p. 136, The Electrochemical Society Proceedings Series, Pennington, NJ (1999).
4. A Model of Chemical Mechanical Planarization of Patterned Wafers with Fixed Abrasives
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