Fabricating Thin-Film Transistors on Plastic Substrates Using Spin Etching and Device Transfer-Reference-Cited by-同舟云学术

Fabricating Thin-Film Transistors on Plastic Substrates Using Spin Etching and Device Transfer

Published:2005 Issue:3 Volume:152 Page:G227
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Wang Shuo-Cheng,Yeh Ching-Fa,Hsu Chung-Ti,Lou Jen-Chung

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. P. G. Carey, P. M. Smith, S. D. Theiss, P. Wickboldt, T. W. Sigmon, Y. J. Tung, and T. J. King, inProceedings of IEEE LEOS’98, IEEE, p. 126 (1998).

2. M. Luniak, inProceedings of the First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, IEEE, p. 314 (2001).

3. Flexible and bistable FLC and cholesteric displays on plastic substrates for mobile applications and smart cards

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental Study on Etching Characteristics of a Spin-Etching Method;Journal of Microelectromechanical Systems;2015-12

2. CMOS-Technology-Enabled Flexible and Stretchable Electronics for Internet of Everything Applications;Advanced Materials;2015-11-26

3. Polysilicon thin-film transistors on polymer substrates;Materials Science in Semiconductor Processing;2012-12

4. Single-Crystalline Silicon Layer Transfer to a Flexible Substrate Using Wafer Bonding;Journal of Electronic Materials;2010-06-24

5. Adhesive wafer bonding;Journal of Applied Physics;2006-02