1. A. C. Adams, inVLSI Technology, 2nd ed., S. M. Sze, Editor, p. 233, McGraw-Hill Int. Ed., New York (1988).
2. S. Wolf and R. Tauber, inSilicon Processing for the VLSI Era, S. Wolf, Editor, Lattice. Lattice Press, Sunset Beach, CA, Vol. 1, p. 161 (1986), Vol. 2, p. 84 (1990).
3. C. H. Ting, inHandbook of Multilevel Metallization for Integrated Circuits, S. R. Wilson, C. J. Tracy, and J. L. Freeman, Editors, p. 202, Noyes Publications, Park Ridge, NJ (1993).
4. H. C. Cheng, inULSI Technology, C. Y. Chang and S. M. Sze, Editors, p. 205, McGraw-Hill Int. Ed., New York (1996).
5. T. G. Duhanova, V. Yu. Vassiliev, and Yu. I. Veretenin, inReviews on Electronic Technology, Ser. 3, Vol. 1370, Institute Electronics, Moscow (1988), in Russian.