Low Temperature Processing of Porous Silicon Films for Wafer Bonding-Based Thin-Film Layer Transfer Applications-Reference-Cited by-同舟云学术

Low Temperature Processing of Porous Silicon Films for Wafer Bonding-Based Thin-Film Layer Transfer Applications

Published:2010 Issue:10 Volume:157 Page:H909
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Joshi M. B.,Hu S. J.,Goorsky M. S.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

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