Abstract
Various Micro- Electro- Mechanical Systems (MEMS) devices are incorporated into mobile electronic devices. A particular category of MEMS devices require vacuum packaging by wafer bonding with the requirement to encapsulate vacuum levels of 10-3 mbar or higher with long time stability. The vacuum requirement is limiting the choice of the wafer bonding process and raises significant challenges to the existing investigation methods (metrology) used for results qualification. This paper reviews some important aspects related to process choice and provides an overview of the needs to be addresses in terms of metrology for wafer bonding.
Publisher
The Electrochemical Society
Cited by
1 articles.
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