Thermal Resistance Evaluation of a Low-Inductance Double-Stacked SiN-AMC Substrate for a High-Temperature Operation SiC Power Module
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Published:2018-07-23
Issue:12
Volume:86
Page:107-112
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ISSN:1938-6737
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Container-title:ECS Transactions
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language:en
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Short-container-title:ECS Trans.
Author:
Kato FumikiORCID,
Sato ShinjiORCID,
Tanisawa Hidekazu,
Koui Kenichi,
Watanabe Kinuyo,
Murakami Yoshinori,
Yamaguchi Hiroshi,
Sato Hiroshi
Publisher
The Electrochemical Society