Additives for Superconformal Electroplating of Ag Thin Film for ULSIs

Author:

Ahn Eung Jin,Kim Jae Jeong

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference11 articles.

1. Silver metallization for advanced interconnects

2. The X-ray investigation of the ternary NdAgSi system

3. T. B. Massalski, J. L. Murray, L. H. Bennett, and H. Baker, Binary Alloy Phase Diagrams , p. 68, American Society for Metals, Metals Park, OH (1986).

4. Improvement of morphological stability of Ag thin film on a TiN layer with a thin interposing metal layer

5. Chemical vapor deposition of silver

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