The Role of an Electrolysis Reduction in Copper‐Electroplating on Transparent Semiconductor Tin Oxide-Reference-Cited by-同舟云学术

The Role of an Electrolysis Reduction in Copper‐Electroplating on Transparent Semiconductor Tin Oxide

Published:1994-04-01 Issue:4 Volume:141 Page:L38-L40
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Liu J. S.¹,Laverty S. J.¹,Maguire P.¹,McLaughlin J.¹,Molloy J.¹

Affiliation:

1. Department of Electrical and Electronic Engineering and Northern Ireland Bio‐Engineering Centre, University of Ulster, Jordanstown, Northern Ireland

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2054872/pdf

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