Effects of Mechanical Parameters on CMP Characteristics Analyzed by Two-Dimensional Frictional-Force Measurement-Reference-Cited by-同舟云学术

Effects of Mechanical Parameters on CMP Characteristics Analyzed by Two-Dimensional Frictional-Force Measurement

Published:2003 Issue:12 Volume:150 Page:G751
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Homma Yoshio,Fukushima Kikuo,Kondo Seiichi,Sakuma Noriyuki

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. R. R. Uttecht and R. M. Geffken, inProceedings of the International VLSI Multilevel Interconnection Conference, VMIC, IEEE, p. 20 (1991).

2. K. Konishi, U.S. Pat. 3,895,391 (1975), Japanese Pat., P879423.

3. T. Izumitani and S. Adachi, inTechnical Digest of the Topical Meeting on the Science of Polishing, The Optical Society of America, p. Tub-Al-1 (1984).

4. Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects

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