Impact of an Amino-Alcohol Organic Molecule on SiO2 and Si Bonding Energy

Abstract

Adherence is one of the main interested parameter characteristic of direct bonding. For silicon oxide and silicon bonding, different technics are known to increase the direct bonding energy after a low post bonding annealing. Plasma activation and mechanical polishing for instance can increase the adherence above 3 J/m² keeping a post bonding annealing temperature below 300°C. A new technic will be presented in this study. Indeed adding a specific organic molecule on the surfaces just before the bonding allow obtaining the same result.