(Invited) Hybrid Wafer bonding and Heterogeneous Integration of GaN HEMTs and Si (100) MOSFETs

Abstract

Nitride-based semiconductors have received considerable attention during the last decade due to their outstanding properties for optoelectronic, high frequency, and high power applications. The integration of GaN and Si (100) devices on the same chip would enable a vast array of new applications, from novel power distribution schemes in Si microsystems, to power digital-toanalog converters and new opportunities for optoelectronic devices integrated on a Si platform. This paper aims to summarize some of the recent results on the heterogeneous integration of GaN and Si (100) devices and circuits by using a hybrid 4" wafer bonding technology.