Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding

Abstract

Different microelectronic processes require very clean surfaces in terms of particulate contamination. Among them, direct wafer bonding has very aggressive requirement in terms of particulate cleanliness. Current work describes development, testing and verification of a single wafer megasonic cleaning method utilizing a transducer design that meets extreme particle neutrality, particle removal efficiency and repeatability requirements of production scale wafer bonding and other very low particle applications. Wafer bonding will also be used as a characterization technique.