Interfacial Transitional Layer in SiO2 Film Thermally Grown on SiC(000-1)
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Published:2016-08-23
Issue:12
Volume:75
Page:123-129
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ISSN:1938-5862
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Container-title:ECS Transactions
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language:
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Short-container-title:ECS Trans.
Author:
Nagai Ryu,Iitsuka Nozomu,Ozawa Kodai,Hasunuma Ryu,Yamabe Kikuo
Abstract
The uniformity of SiO2 film thermally grown on 4H-SiC was characterized by atomic force microscopic observation of the emerged SiO2 surface after each step-etching using diluted HF solution. It was found that roughness of the emerged SiO2 surface drastically increases near the SiO2/SiC interface. This means that the film quality near the interface is not two-dimensionally uniform. We described the two-dimensionally non-uniform. On the other hand, the amount of roughness increase at the middle region was small, indicating the middle region is uniform film. These results indicate that the region is two-dimensionally uniform. These results indicate that the oxide film contains non-uniformly when just after being formed, and then the two-dimensional film uniformity is gradually improved during subsequent oxidation. Density profiles of SiO2 films were also characterized. The uniformity improvement was discussed in terms of impurity desorption and film density.
Publisher
The Electrochemical Society
Cited by
1 articles.
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