A Field‐Assisted Bonding Process for Silicon Dielectric Isolation

Author:

Frye R. C.1,Griffith J. E.1,Wong Y. H.1

Affiliation:

1. AT&T Bell Laboratories, Murray Hill, New Jersey 07974

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

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