Author:
Sun Xiao,De Raedt Walter,Beyne Eric
Abstract
This paper presents a 3D heterogeneous approach to integrate a FBAR device and some 3D modules, which provide both addition-al interconnects, RF functions and packaging functionality. The feasibility of this approach has been proven by the successful reali-zation of 3D demonstration vehicles. The RF behavior of the de-monstrators has been assessed and good performances have been obtained.
Publisher
The Electrochemical Society
Cited by
1 articles.
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1. High density 3D heterogeneous integration used in microwave modules;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10