Abstract
It is generally known that Ulrich Gösele has made numerous important contributions in different distinguished areas in materials science: diffusion and defects in semiconductors, semiconductor nanoparticles and nanowires, silicon photonics and photonic crystals, self-organized nanoscale structures, and semiconductor wafer bonding. The paper will honor his contribution to the development of wafer bonding techniques and the understanding of the physical and chemical processes at the interfaces of bonded wafers.
Publisher
The Electrochemical Society