Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition-Reference-Cited by-同舟云学术

Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition

Published:2008 Issue:5 Volume:155 Page:H296
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Kwon Se-Hun,Kwon Oh-Kyum,Kim Jin-Hyock,Oh Heung-Ryong,Kim Kwang-Ho,Kang Sang-Won

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Enhancement of Iodine Adsorption Using I[sub 2] Plasma for Seedless Catalyst-Enhanced CVD of Copper

2. Properties of Copper Films Prepared by Chemical Vapor Deposition for Advanced Metallization of Microelectronic Devices

3. Atomic Layer Deposition of Copper Seed Layers

4. Evaluation of Cu adhesive energy on barrier metals by means of contact‐angle measurement

5. Stress in Copper Seed Layer Employing in the Copper Interconnection

Cited by 41 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Anti-Reflective Coatings Produced via Atomic Layer Deposition for Hybrid Polymer 3D Micro-Optics;Nanomaterials;2023-08-08

2. Nucleation of Co and Ru Precursors on Silicon with Different Surface Terminations: Impact on Nucleation Delay;The Journal of Physical Chemistry C;2023-07-07

3. In Situ Engineering of a Metal Oxide Protective Layer into Pt/Carbon Fuel-Cell Catalysts by Atomic Layer Deposition;Chemistry of Materials;2022-06-21

4. Controllable size and crystallinity of Ru nanoparticles on a carbon support synthesized by fluidized bed reactor-atomic layer deposition for enhanced hydrogen oxidation activity;Journal of Materials Chemistry A;2021

5. Impact of the Atomic Layer-Deposited Ru Electrode Surface Morphology on Resistive Switching Properties of TaOx-Based Memory Structures;ACS Applied Materials & Interfaces;2020-11-16