(Invited) Development of CMOS-MEMS Cointegrated Pressure Sensor Using Minimal Fab Process

Author:

Liu Yongxun,Akita Ippei,Matsukawa Takashi,Tanaka Hiroyuki,Koga Kazuhiro,Nemoto Kazumasa,Khumpuang Sommawan,Nagao Masayoshi,Morita Yukinori,Hara Shiro

Abstract

PVD-TiN metal gate PMOSFETs and CMOS ring oscillators have successfully been fabricated on circular diaphragms using the developed Minimal Fab CMOS-MEMS cointegrated gate-last process, and their electrical characteristics have systematically been investigated by changing applied pressures to the diaphragms. It was found that the drain current variation (dId) in the <110> channel PMOSFETs is larger than that in the <100> channel ones. The origin of dId is the mechanical stress-induced mobility change. It was also confirmed that the oscillation frequency of the fabricated CMOS ring oscillator on a circular diaphragm changes from 372 to 405 kHz at different pressures of -30 and +30 kPa. This result implies that the fabricated CMOS-MEMS cointegrated sensor chip is operated as a pressure sensor. The developed CMOS-MEMS cointegrated pressure sensor is suitable for the application to the battery drive IoT sensor systems because the all CMOS integration of the sensor has a low-power consumption.

Publisher

The Electrochemical Society

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. MEMS Pressure Sensors Design, Simulation, Manufacturing, Interface Circuits: A Review;IEEE Sensors Journal;2024-03-15

2. System Level Simulation of MEMS Pressure Sensor;2023 International Conference on Electrical Engineering and Photonics (EExPolytech);2023-10-19

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