1. J. N., H. V. D. V. M., V. G. V., C. K., L. A., V. P. O., V. E. S., B. J., and T. Z., in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) 37 (2016).
2. Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects
3. Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill
4. Bard A. J. Parsons R. Jordan J. , Standard potentials in aqueous solution, CRC press, New York (1985).
5. Electrochemical behavior of copper and cobalt in post-etch cleaning solutions