Analysis of Mass Transport and Ohmic Limitations in Through‐Hole Plating-Reference-Cited by-同舟云学术

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Analysis of Mass Transport and Ohmic Limitations in Through‐Hole Plating

Published:1988-08-01 Issue:8 Volume:135 Page:1922-1930
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Lanzi Oscar¹,Landau Uziel¹

Affiliation:

1. Department of Chemical Engineering, Case Western Reserve University, Cleveland, OH 44106

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2096180/pdf

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel PMMA based 96-well microelectrode arrays for bioelectronic high throughput monitoring of cells in a live mode;Biosensors and Bioelectronics;2022-04

2. Effect of the macro- and microthrowing power of the electrolyte on the uniformity of distribution of electroplated copper in through-holes for PCB;Journal of Solid State Electrochemistry;2021-03-04

3. Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship;Microelectronics Reliability;2019-05

4. Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures;Journal of The Electrochemical Society;2019

5. Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes;Electrochimica Acta;2016-09

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