Thermal Stress Reduction of Copper Through Silicon Via (TSV) with Annealing-Reference-Cited by-同舟云学术

Thermal Stress Reduction of Copper Through Silicon Via (TSV) with Annealing

Published:2018 Issue:11 Volume:7 Page:P689-P692
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Dinh Van Quy^ORCID,Kondo Kazuo^ORCID,Hoang Van Ha^ORCID,Hirato Tetsuji

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference15 articles.

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3. Cho S.-D. , Sematech Symp. Korea, 2011-Oct., 27 (2011).

4. Lu K. H. , in 2009 59th Electronic Components and Technology Conference, p. 630, IEEE (2009).

5. Zhou Jing , in 2011 IEEE 13th Electronics Packaging Technology Conference, p. 686, IEEE (2011).

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