Silicon Carbide Wafer Bonding-Reference-Cited by-同舟云学术

Silicon Carbide Wafer Bonding

Published:1995-01-01 Issue:1 Volume:142 Page:232-236
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Tong Q. ‐Y.¹,Gösele U.¹²,Yuan C.¹²³²,Steckl A. J.¹²³²,Reiche M.¹²³²

Affiliation:

1. Wafer Bonding Laboratory, Duke University, Durham, North Carolina 27708

2. Max‐Planck‐Institute of Microstructure Physics, D‐06120 Halle/Saale, Germany

3. Department of Electrical and Computer Engineering, University of Cincinnati, Cincinnati, Ohio 45221

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2043876/pdf

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